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Beryllium oxide is a unique material for electrical and mechanical applications which require high thermal conductivity along with dielectric and mechanical strength. It is particularly well suited for use as a semiconductor heat sink and as a heat dissipation medium in miniaturized circuitry.
Heat sinks and other semiconductor parts are manufactured in a range of sizes readily adaptable to the basic requirements of the industry. Sizes, configurations, hole sizes and placements conform to conventional TO case sizes, and are maintained within close tolerances to facilitate assembly.
Available in any quantity, mostly from stock, beryllium oxide heat sinks more than justify higher costs than other materials by demonstrating higher temperature capability, realistic power vs. frequency relationships and greater cost effectiveness resulting from improved reliability.
American Beryllia manufactures a wide variety of custom BeO ceramic parts for various applications. Materials are prepared by dry pressing, isostatic pressing, hot pressing, tape casting, and extrusion machining. American Beryllia’s capabilities also include machining metalizing and plating among others.
Click here for some of our Beryllium Oxide TO Packages
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