Metalizing

Thick-film metallization can be applied to fired ceramics to provide a bonding surface for subsequent attachment of chips or metal parts. ABI’s standard metallization usually consists of moly-manganese, nickel, and if needed, a flash of gold or silver. If needed, we can provide other metallization configurations including thin-film sputtering.

Precision Grinding

Both manual and automatic CNC grinding techniques are used to achieve precise physical dimensions not possible in an "as-fired" part. Available methods include centerless, cylindrical,surface, surface and inside diameter grinding using diamond wheels. Dimensional tolerances of +/-0.0005" inches (0.025mm) can be met with simple and complex geometries.

Lapping and Polishing

Lapping and polishing are used to achieve specific surface finish, flatness, and parallelism. In the lapping process, revolving flat surfaces abrade the ceramic part with a diamond or other abrasive lapping compound. The surface finish is controlled through selection of the proper abrasive, pressure, and lapping cycle.

Dicing

Advanced, computer-controlled dicing equipment with diamond saw blades, similar to machines used for dicing integrated circuit wafers, are used to cut ceramic wafers into predetermined shapes and sizes. Linear cuts at any desired angle are also possible with this equipment.

Beryllium Oxide Manufacturing Process